Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%
Copper sputtering target, diam. x thickness 25.4 mm x 1 mm (CAS 7440-50-8) – thin-film deposition material, Puriss grade, 99.99%. Cu, MW 63.55. COA included.
About Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%
Vaqora Chemicals supplies Copper sputtering target, diam. x thickness 25.4 mm x 1 mm (Puriss grade), a thin-film deposition material registered under CAS number 7440-50-8 with a typical assay of 99.99%. Formula Cu, molecular weight 63.55 g/mol. The IUPAC name is copper.
The product is provided as a solid. Reported physical data include a boiling point of 2567 °C and a density of 8.94 g/mL at 25 °C. Store in a tightly closed container in a cool, dry and well-ventilated place. The GHS classification uses the signal word “Warning”, so appropriate gloves, eye protection and ventilation are recommended.
Typical applications include PVD and sputter coating, thin-film deposition and semiconductor fabrication. Typical end-use sectors are academic and industrial research and electronics and semiconductors.
Available in 1 pc and 5 x 1 pc packs, Copper sputtering target, diam. x thickness 25.4 mm x 1 mm is dispatched with a Certificate of Analysis (COA) to destinations worldwide.
Typical applications
- PVD & sputter coating
- Thin-film deposition
- Semiconductor fabrication
Industries
Specifications & identifiers
| Product name | Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9% |
|---|---|
| Catalogue No. | VQ-017077 |
| CAS Number | 7440-50-8 |
| IUPAC name | copper |
| Molecular formula | Cu |
| Molecular weight | 63.55 g/mol |
| Exact mass | 62.9296 |
| Grade | Puriss |
| Purity / assay | 99.99% |
| HSN code | 74061000 |
| InChIKey | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| SMILES | [Cu] |
| PubChem CID | 23978 |
| Physical form | Solid |
|---|---|
| Appearance | Solid |
| Boiling point | 2567 °C |
| Density | 8.94 g/mL at 25 °C |
| H-bond donors / acceptors | 0 / 0 |
| TPSA | 0 Ų |
| UN number | UN 3077 |
Safety & hazard information (GHS)
Signal word: Warning
Hazard statements
H400Very toxic to aquatic lifeH410Very toxic to aquatic life with long lasting effects
Precautionary statements: P273, P391, P501
Classification is indicative (aggregated GHS notifications) and may vary by grade and concentration. Always refer to the SDS supplied with your lot.
Documents
Other grades of CAS 7440-50-8
Frequently asked questions
What is the CAS number of Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%?
The CAS Registry Number of Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9% is 7440-50-8.
What is the molecular formula and molecular weight of Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%?
Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9% has the molecular formula Cu and a molecular weight of 63.55 g/mol. Its IUPAC name is copper.
Which grade and pack sizes of Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9% can I order?
We supply Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9% in Puriss (99.99%) grade, in 1 pc, 5 x 1 pc packs. Larger bulk quantities and custom packing are quoted on request.
Do you provide a COA and SDS with Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%?
Yes. Every lot of Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9% is shipped with a batch-specific Certificate of Analysis, and a 16-section GHS Safety Data Sheet is provided with the quotation and the shipment.
Can Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9% be shipped internationally?
Yes. Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9% is classified as hazardous (UN 3077), so it is packed in UN-approved packaging and shipped as dangerous goods under IATA/IMDG rules. We export worldwide on EXW, FOB, CIF and DAP terms.
Enquire about Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%
We reply within one business day with price, pack options, lead time and documentation.
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