Platinum sputtering target, 99.99% (bonded with Copper backing plate)
Platinum sputtering target (CAS 7440-06-4) – thin-film deposition material, 99.99%. Pt, MW 195.08. From Vaqora Chemicals, with COA and worldwide delivery.
About Platinum sputtering target, 99.99% (bonded with Copper backing plate)
Platinum sputtering target is a thin-film deposition material carrying the CAS registry number 7440-06-4 at a purity of 99.99%. Formula Pt, molecular weight 195.08 g/mol. Its systematic (IUPAC) name is platinum.
It is supplied as a solid. Store sealed in a dry, well-ventilated location away from incompatible materials. The GHS classification uses the signal word “Danger”, so appropriate gloves, eye protection and ventilation are recommended.
Typical applications include PVD and sputter coating, thin-film deposition, semiconductor fabrication and catalysis. Our customers for this product work in academic and industrial research and electronics and semiconductors.
Vaqora Chemicals supplies Platinum sputtering target in 1 pc and 5 pc packs, each shipped with a Certificate of Analysis (COA), and exports worldwide. SDS and detailed specification sheets can be requested with your quotation.
Typical applications
- PVD & sputter coating
- Thin-film deposition
- Semiconductor fabrication
- Catalysis
Industries
Specifications & identifiers
| Product name | Platinum sputtering target, 99.99% (bonded with Copper backing plate) |
|---|---|
| Catalogue No. | VQ-017199 |
| CAS Number | 7440-06-4 |
| IUPAC name | platinum |
| Molecular formula | Pt |
| Molecular weight | 195.08 g/mol |
| Exact mass | 194.9648 |
| Purity / assay | 99.99% |
| HSN code | 38151200 |
| InChIKey | BASFCYQUMIYNBI-UHFFFAOYSA-N |
| SMILES | [Pt] |
| PubChem CID | 23939 |
| Physical form | Solid |
|---|---|
| H-bond donors / acceptors | 0 / 0 |
| TPSA | 0 Ų |
| UN number | UN 3089 |
Safety & hazard information (GHS)
Signal word: Danger
Hazard statements
H228Flammable solid
Precautionary statements: P210, P240, P241, P280, P370 + P378
Classification is indicative (aggregated GHS notifications) and may vary by grade and concentration. Always refer to the SDS supplied with your lot.
Documents
Other grades of CAS 7440-06-4
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
Frequently asked questions
What is the CAS number of Platinum sputtering target, 99.99% (bonded with Copper backing plate)?
The CAS Registry Number of Platinum sputtering target, 99.99% (bonded with Copper backing plate) is 7440-06-4.
What is the molecular formula and molecular weight of Platinum sputtering target, 99.99% (bonded with Copper backing plate)?
Platinum sputtering target, 99.99% (bonded with Copper backing plate) has the molecular formula Pt and a molecular weight of 195.08 g/mol. Its IUPAC name is platinum.
Which grade and pack sizes of Platinum sputtering target, 99.99% (bonded with Copper backing plate) can I order?
We supply Platinum sputtering target, 99.99% (bonded with Copper backing plate) in (99.99%) grade, in 1 pc, 5 pc packs. Larger bulk quantities and custom packing are quoted on request.
Do you provide a COA and SDS with Platinum sputtering target, 99.99% (bonded with Copper backing plate)?
Yes. Every lot of Platinum sputtering target, 99.99% (bonded with Copper backing plate) is shipped with a batch-specific Certificate of Analysis, and a 16-section GHS Safety Data Sheet is provided with the quotation and the shipment.
Can Platinum sputtering target, 99.99% (bonded with Copper backing plate) be shipped internationally?
Yes. Platinum sputtering target, 99.99% (bonded with Copper backing plate) is classified as hazardous (UN 3089), so it is packed in UN-approved packaging and shipped as dangerous goods under IATA/IMDG rules. We export worldwide on EXW, FOB, CIF and DAP terms.
Enquire about Platinum sputtering target, 99.99% (bonded with Copper backing plate)
We reply within one business day with price, pack options, lead time and documentation.
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