- CAS
- 1314-98-3
- Formula
- SZn
- MW
- 97.4 g/mol
Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9%
Synonyms: Irtran 2 · Sachtolith HD-S · Cleartran · FV 40-1
Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm (CAS 1314-98-3) – thin-film deposition material, 99.9%. SZn, MW 97.4.
About Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9%
Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm is a thin-film deposition material carrying the CAS registry number 1314-98-3 at a purity of 99.9%. Its molecular formula is SZn and its molecular weight is 97.4 g/mol. Its systematic (IUPAC) name is zinc sulfide. Alternative names: Irtran 2 and Sachtolith HD-S.
It is supplied as a solid. Store sealed in a dry, well-ventilated location away from incompatible materials. Good laboratory practice and suitable PPE are recommended during handling.
Typical applications include PVD and sputter coating, thin-film deposition and semiconductor fabrication. Our customers for this product work in academic and industrial research and electronics and semiconductors.
Vaqora Chemicals supplies Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm in 1 pc packs, each shipped with a Certificate of Analysis (COA), and exports worldwide.
Typical applications
- PVD & sputter coating
- Thin-film deposition
- Semiconductor fabrication
Industries
Specifications & identifiers
| Product name | Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9% |
|---|---|
| Catalogue No. | VQ-017298 |
| CAS Number | 1314-98-3 |
| IUPAC name | zinc sulfide |
| Molecular formula | SZn |
| Molecular weight | 97.4 g/mol |
| Exact mass | 95.9012 |
| Purity / assay | 99.9% |
| HSN code | 28309010 |
| InChIKey | DRDVZXDWVBGGMH-UHFFFAOYSA-N |
| SMILES | [S-2].[Zn+2] |
| PubChem CID | 9833931 |
| Physical form | Solid |
|---|---|
| Appearance | Solid |
| H-bond donors / acceptors | 0 / 1 |
| TPSA | 1 Ų |
| Synonyms | Irtran 2, Sachtolith HD-S, Cleartran, FV 40-1, FV 40-1 (sulfide), HD-S, ZNI 08PB, Arsenic Sulfide (As2S3) Sputtering Targets |
Documents
Other grades of CAS 1314-98-3
Frequently asked questions
What is the CAS number of Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9%?
The CAS Registry Number of Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9% is 1314-98-3. It is also known as Irtran 2, Sachtolith HD-S, Cleartran.
What is the molecular formula and molecular weight of Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9%?
Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9% has the molecular formula SZn and a molecular weight of 97.4 g/mol. Its IUPAC name is zinc sulfide.
Which grade and pack sizes of Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9% can I order?
We supply Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9% in (99.9%) grade, in 1 pc packs. Larger bulk quantities and custom packing are quoted on request.
Do you provide a COA and SDS with Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9%?
Yes. Every lot of Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9% is shipped with a batch-specific Certificate of Analysis, and a 16-section GHS Safety Data Sheet is provided with the quotation and the shipment.
Can Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9% be shipped internationally?
Yes. We export Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9% worldwide by air and sea freight or express courier, on EXW, FOB, CIF, CFR or DAP Incoterms, with full export documentation.
Enquire about Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9%
We reply within one business day with price, pack options, lead time and documentation.
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