Platinum black, powder, ≤20 μm, ≥99.95% trace metals basis
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
VQ-016177
Platinum sputtering target, 50.8mm (2.0in) dia x 1.6 mm (0.063 in) thick, 99.99%
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
VQ-017198
Platinum sputtering target, 99.99% (bonded with Copper backing plate)
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
VQ-017199
Platinum sputtering target, dia 1 inch x 1 mm thick, 99.95%
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
VQ-017200
Platinum sputtering target, dia 1 inch x 1 mm thick, 99.99%
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
VQ-017201
Platinum sputtering target, dia 1 inch x 2 mm thick, 99.99%
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
VQ-017202
Platinum sputtering target, dia 2 inch x 2 mm thick, 99.95%
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
VQ-017203
Platinum sputtering target, dia 2 inch x 2 mm thick, 99.99%
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
VQ-017204
Platinum sputtering target, dia 3 inch x 0.5 mm thick, 99.95%
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
VQ-017205
Platinum sputtering target, dia 57 mm x 0.1 mm thick, 99.9%
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
VQ-017206
Platinum sputtering target, diam. × thickness 2 in. × 1 mm, 99.9%
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
VQ-017207