Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm
Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm (CAS 7440-21-3) – optical window. Si, MW 28.09. With COA, ships worldwide.
About Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm
Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm is an optical window carrying the CAS registry number 7440-21-3. With the molecular formula Si, it has a molar mass of 28.09 g/mol. Systematically, it is named silicon.
The product is provided as a solid. Store in a tightly closed container in a cool, dry and well-ventilated place. The GHS classification uses the signal word “Danger”, so appropriate gloves, eye protection and ventilation are recommended.
Typical applications include optical windows, IR and UV optics, coated substrates and electronics and thin films. Our customers for this product work in academic and industrial research and electronics and semiconductors.
Standard pack sizes are 1 pc, 10 pc and 100 pc, and every batch ships with a Certificate of Analysis (COA) and we export worldwide.
Typical applications
- Optical windows
- IR & UV optics
- Coated substrates
- Electronics & thin films
Industries
Specifications & identifiers
| Product name | Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm |
|---|---|
| Catalogue No. | VQ-018108 |
| CAS Number | 7440-21-3 |
| IUPAC name | silicon |
| Molecular formula | Si |
| Molecular weight | 28.09 g/mol |
| Exact mass | 27.9769 |
| HSN code | 9002 |
| InChIKey | XUIMIQQOPSSXEZ-UHFFFAOYSA-N |
| SMILES | [Si] |
| PubChem CID | 5461123 |
| Physical form | Solid |
|---|---|
| H-bond donors / acceptors | 0 / 0 |
| TPSA | 0 Ų |
Safety & hazard information (GHS)
Signal word: Danger
Hazard statements
H228Flammable solidH320Causes eye irritation
Precautionary statements: P210, P240, P241, P264 + P265, P280, P305 + P351 + P338, P337 + P317, P370 + P378
Classification is indicative (aggregated GHS notifications) and may vary by grade and concentration. Always refer to the SDS supplied with your lot.
Documents
Other grades of CAS 7440-21-3
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
Frequently asked questions
What is the CAS number of Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm?
The CAS Registry Number of Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm is 7440-21-3.
What is the molecular formula and molecular weight of Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm?
Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm has the molecular formula Si and a molecular weight of 28.09 g/mol. Its IUPAC name is silicon.
Which grade and pack sizes of Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm can I order?
We supply Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm, in 1 pc, 10 pc, 100 pc packs. Larger bulk quantities and custom packing are quoted on request.
Do you provide a COA and SDS with Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm?
Yes. Every lot of Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm is shipped with a batch-specific Certificate of Analysis, and a 16-section GHS Safety Data Sheet is provided with the quotation and the shipment.
Can Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm be shipped internationally?
Yes. Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm is classified as hazardous, so it is packed in UN-approved packaging and shipped as dangerous goods under IATA/IMDG rules. We export worldwide on EXW, FOB, CIF and DAP terms.
Enquire about Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm
We reply within one business day with price, pack options, lead time and documentation.
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