Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm
Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm (CAS 7440-21-3) – optical window. Si, MW 28.09. With COA, ships worldwide.
About Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm
Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm is an optical window carrying the CAS registry number 7440-21-3. Formula Si, molecular weight 28.09 g/mol. Its systematic (IUPAC) name is silicon.
It is supplied as a solid. Keep the container tightly sealed and store it in a cool, dry area. It carries the GHS signal word “Danger” with 2 hazard statements. Review the Safety Data Sheet before use.
Key uses span optical windows, IR and UV optics and coated substrates. Buyers come mainly from academic and industrial research and electronics and semiconductors.
Vaqora Chemicals supplies Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm in 1 pc packs, each shipped with a Certificate of Analysis (COA), and exports worldwide.
Typical applications
- Optical windows
- IR & UV optics
- Coated substrates
Industries
Specifications & identifiers
| Product name | Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm |
|---|---|
| Catalogue No. | VQ-018123 |
| CAS Number | 7440-21-3 |
| IUPAC name | silicon |
| Molecular formula | Si |
| Molecular weight | 28.09 g/mol |
| Exact mass | 27.9769 |
| HSN code | 90019002 |
| InChIKey | XUIMIQQOPSSXEZ-UHFFFAOYSA-N |
| SMILES | [Si] |
| PubChem CID | 5461123 |
| Physical form | Solid |
|---|---|
| H-bond donors / acceptors | 0 / 0 |
| TPSA | 0 Ų |
Safety & hazard information (GHS)
Signal word: Danger
Hazard statements
H228Flammable solidH320Causes eye irritation
Precautionary statements: P210, P240, P241, P264 + P265, P280, P305 + P351 + P338, P337 + P317, P370 + P378
Classification is indicative (aggregated GHS notifications) and may vary by grade and concentration. Always refer to the SDS supplied with your lot.
Documents
Other grades of CAS 7440-21-3
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
Frequently asked questions
What is the CAS number of Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm?
The CAS Registry Number of Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm is 7440-21-3.
What is the molecular formula and molecular weight of Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm?
Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm has the molecular formula Si and a molecular weight of 28.09 g/mol. Its IUPAC name is silicon.
Which grade and pack sizes of Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm can I order?
We supply Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm, in 1 pc packs. Larger bulk quantities and custom packing are quoted on request.
Do you provide a COA and SDS with Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm?
Yes. Every lot of Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm is shipped with a batch-specific Certificate of Analysis, and a 16-section GHS Safety Data Sheet is provided with the quotation and the shipment.
Can Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm be shipped internationally?
Yes. Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm is classified as hazardous, so it is packed in UN-approved packaging and shipped as dangerous goods under IATA/IMDG rules. We export worldwide on EXW, FOB, CIF and DAP terms.
Enquire about Silicon wafer, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm
We reply within one business day with price, pack options, lead time and documentation.
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