Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm
Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm (CAS 7440-21-3) – optical window. Si, MW 28.09. With COA, ships worldwide.
About Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm
Vaqora Chemicals supplies Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm, an optical window registered under CAS number 7440-21-3. The compound has the formula Si, corresponding to a molecular weight of 28.09 g/mol. Its systematic (IUPAC) name is silicon.
The product is provided as a solid. Store sealed in a dry, well-ventilated location away from incompatible materials. Under GHS it is labelled “Danger”, so handle it with suitable PPE and consult the SDS.
Key uses span optical windows, IR and UV optics, coated substrates and electronics and thin films. It is used across academic and industrial research and electronics and semiconductors.
Vaqora Chemicals supplies Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm in 1 pc and 10 pc packs, each shipped with a Certificate of Analysis (COA), and exports worldwide.
Typical applications
- Optical windows
- IR & UV optics
- Coated substrates
- Electronics & thin films
Industries
Grade guides
Specifications & identifiers
| Product name | Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm |
|---|---|
| Catalogue No. | VQ-018124 |
| CAS Number | 7440-21-3 |
| IUPAC name | silicon |
| Molecular formula | Si |
| Molecular weight | 28.09 g/mol |
| Exact mass | 27.9769 |
| HSN code | 9002 |
| InChIKey | XUIMIQQOPSSXEZ-UHFFFAOYSA-N |
| SMILES | [Si] |
| PubChem CID | 5461123 |
| Physical form | Solid |
|---|---|
| H-bond donors / acceptors | 0 / 0 |
| TPSA | 0 Ų |
Safety & hazard information (GHS)
Signal word: Danger
Hazard statements
H228Flammable solidH320Causes eye irritation
Precautionary statements: P210, P240, P241, P264 + P265, P280, P305 + P351 + P338, P337 + P317, P370 + P378
Classification is indicative (aggregated GHS notifications) and may vary by grade and concentration. Always refer to the SDS supplied with your lot.
Documents
Other grades of CAS 7440-21-3
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
Frequently asked questions
What is the CAS number of Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm?
The CAS Registry Number of Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm is 7440-21-3.
What is the molecular formula and molecular weight of Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm?
Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm has the molecular formula Si and a molecular weight of 28.09 g/mol. Its IUPAC name is silicon.
Which grade and pack sizes of Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm can I order?
We supply Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm, in 1 pc, 10 pc packs. Larger bulk quantities and custom packing are quoted on request.
Do you provide a COA and SDS with Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm?
Yes. Every lot of Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm is shipped with a batch-specific Certificate of Analysis, and a 16-section GHS Safety Data Sheet is provided with the quotation and the shipment.
Can Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm be shipped internationally?
Yes. Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm is classified as hazardous, so it is packed in UN-approved packaging and shipped as dangerous goods under IATA/IMDG rules. We export worldwide on EXW, FOB, CIF and DAP terms.
Enquire about Silicon wafer, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm
We reply within one business day with price, pack options, lead time and documentation.
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